Product | Solids Content | Application Area | Activators | ISO-9454 | DIN EN 61190-1-1 |
EO-B-006A | 2,0% | Wave- and selective soldering manual- and repair soldering dip soldering | non-halogen di-carboxylic acids no resin content | 2131 | L0 (ORL0) |
EO-B-006B | 3,0% | Wave- and selective soldering manual- and repair soldering dip soldering | non-halogen di-carboxylic acids no resin content | 2131 | L0 (ORL0) |
EO-B-006C | 4,0% | Wave- and selective soldering manual- and repair soldering dip soldering | non-halogen di-carboxylic acids no resin content | 2131 | L0 (ORL0) |
EO-B-008 | 4,0% | Wave- and selective soldering manual- and repair soldering dip soldering | di-carboxylic acids | 1231 | L0 (REL0) |
EO-B-010A | 2,0% | Wave- and selective soldering manual- and repair soldering dip soldering | di-carboxylic acids low resin content | L0 (REL0) | |
EO-B-010B | 2,6% | Wave- and selective soldering manual- and repair soldering dip soldering | di-carboxylic acids low resin content | 1231 | L0 (REL0) |
EO-B-010C | 4,0% | Wave- and selective soldering manual- and repair soldering dip soldering | di-carboxylic acids low resin content | 1231 | L0 (REL0) |
S-250/FRO | 2,5% | Wave soldering (spray fluxing) | di-carboxylic acids low resin content | 1231 | L0 (REL0) |
GSP-2533/RX | 2,5% | Wave soldering (spray fluxing) | di-carboxylic acids low resin content | 1231 | L0 (REL0) |