EMS is everywhere
EMS is used in practically all products and services, which all have one thing in common: Over past years, the focus has been on replacing alloys that previously contained lead with lead-free EMS alloys – an overriding aim that is in line with strict current and future standards regarding quality and the environment. It is precisely this technical substitution that poses one of the biggest challenges in this area: The aim was to ensure that the lead-free solders are fit for series production in a way that can be quantified and standardised and without any losses in terms of the reliability of assemblies, devices and products. The transitional periods are gradually starting to expire, and the legal framework conditions are leading to an urgent need for the development of new alloys that must meet a large number of requirements. The new soft-solder alloys need to work in all the modified applications, which often involve higher temperature and wear-related loads being exerted on the components and solder systems.
It’s better to be lead-free
This development pervades throughout the entire field of microelectronics: For practically every application, legal guidelines and provisions are becoming more stringent in order to systematically push back on the use of substances that are harmful to the environment and human health. This has led to completely new requirement profiles, such as those for lead-free soft solders with a melting range of below 200°C wherever possible: This reduction also reduces the short-term temperature load on the electronic components during production. At the same time, important parameters relating to the consumable materials such as seep and wetting should also remain as unchanged as possible compared with conventional solders. The leaching properties of lead-free soft solders on boards, electronic components and tools as well as the soldering systems themselves remain another important aspect. In summary: In order to ensure the long-lasting, reliable operation of the end product, the soft-solder characteristics need to be realigned, with more recent developments such as laser soldering or 3D printing also playing an increasingly important role. All alloys must also originate entirely from conflict-free extraction regions or regions of origin in accordance with the current valid Conflict Mineral Report Template (CMRT).
Applications
PCB (printed circuit board) manufacturing
Thick-layer and thin-layer processes. Our customers use thick-layer processing for hot air solder levelling (HASL). Available as bar or ingot solders. Thin-layer surfaces are produced using electroplating processes with metals such as tin, silver and gold.Fitting components
Traditional fitting of components such as capacitors, diodes, transistors, resistors, coils etc. on PCBs using selective and wave soldering systems.Cable assembly
Production of cable systems for the automotive and industrial sectors as well as for other machines, systems and applicationsDip tinning
Tinning or processing of electronic and/or electrical componentsSpecial solder applications
Soft solders for glass contacts, low-temperature soft solders (for fuses), high-temperature soft solders (for temperature-stable connections in the permanent temperature range of 280-300°C) and special solders for embedding material for electrical or electronic components
Product configurator
Here’s how easy it is to find the product you need: Search through our comprehensive range of metals and alloys, select your product and place it in the “enquiry basket”. We will get back to you as soon as possible. Looking for something in particular? Then simply get in touch with us directly - we’ll be happy to help.
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Product Informations
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